Stk411210e Datasheet -
+Vcc (Positive Rail) | +-------+-------+ | | [In L] -----[C1]--| Pin 1 Pin X |--[Zobel]----+---- (Left Spk Out) | | | | STK411-210E | [RL] | | | [In R] -----[C2]--| Pin 2 Pin Y |--[Zobel]----+---- (Right Spk Out) | | +-------+-------+ | -Vcc (Negative Rail) Input Decoupling (
: Pinouts capture the incoming low-level audio signal alongside a dedicated ground line ( GNDcap G cap N cap D ) to prevent noisy ground loops.
The power dissipation is 85W. You must mount this on a large heatsink (at least 1.5 C°/W thermal resistance) with thermal paste. Without a heatsink, it will fail in seconds.
The is part of the STK411-xxx series of thick-film hybrid ICs designed to provide high-quality audio amplification in stereophonic systems. These ICs are cherished for their ability to deliver substantial power with low distortion, making them ideal for high-fidelity audio equipment. stk411210e datasheet
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Compact power amplification for powered monitors. Musical Instrument Amplifiers: Small home practice amps.
Requires a split (dual) power supply (± Vcc). Typical Application Guide +Vcc (Positive Rail) | +-------+-------+ | | [In
The IC uses a standard 18-pin SIP. Hold the IC with the printed label facing you and the heatsink tab to the rear.
According to technical specifications across related SANYO documentation, the operational parameters typically fall within the following ranges at an ambient room temperature ( Typical Operational Rating ±54plus or minus 54 ±65plus or minus 65 (Model variant dependent) Recommended Supply Voltage VCCcap V sub cap C cap C end-sub ±33plus or minus 33 ±40plus or minus 40 Total Harmonic Distortion (at full rated power, Load Resistance RLcap R sub cap L (Symmetrical non-inductive load) Ωcap omega Operating Substrate Temp Tccap T sub c ∘Craised to the composed with power C Storage Temperature Tstgcap T sub s t g end-sub ∘Craised to the composed with power C Pinout Configuration & Internal Architecture
According to technical documentation for the STK411 series, the STK411-210E Without a heatsink, it will fail in seconds
) : Formed at the input pins to trim away ultrasonic radio-frequency interference (RFI) before it can cause internal clipping.
Inside its specialized 22-pin ZIP package, individual semiconductor wafers—including discrete power output transistors and drivers—are mounted directly onto an insulated metal substrate. These internal components are linked via ultra-precise ultrasonic wire bonding. This design offers two key advantages:
